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Specifications
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Standard Technology
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Advanced Technology
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Certifications
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MIL-PRF-55110
MIL-PRF-50884
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MIL-PRF-55110
MIL-PRF-50884
MIL-PRF-31032
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Number of Layers
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1 - 20
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20 – 32
|
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Board Material
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FR4
Polyimide
|
FR4
Polyimide
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Copper Thickness
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0.5 oz - 6 oz
|
6 oz - 10 oz
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|
Hole Aspect Ratio
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12:1
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15 : 1
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Minimum Hole Size
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0.006"
|
0.004"
|
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Controlled Impedance Tolerance
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+/- 10%
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+/-5%
|
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Minimum Trace/Space
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0.004"/0.004"
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0.003"/0.003"
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Final Finish
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HASL (Solder)
Lead Free Solder
Copper
Gold
Gold Fingers
White Tin
OSP
|
HASL
Gold (ENIG/Hard/Soft)
Selective Gold
Immersion Silver
OSP
White Tin
|
|
Solder Mask
|
LPI:
Green
Black
Red
Blue
Yellow
White
Clear
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LPI:
Green
Black
Red
Blue
Yellow
White
Clear
Mix-and-match
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|
Silk Screen
|
White
Black
Yellow
Green
Red
Blue
|
White
Black
Yellow
Green
Red
Blue
|
|
Fabrication
|
Scoring
Route & Retain
Jump Scoring
Milling
|
Jump Scoring
Route & Retain
Milling
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