San Francisco Circuits specializes in PCB prototype fabrication and assembly using advanced technologies. Through our diverse portfolio of production partners, we also build and assemble boards at production quantities.
You may also get a PCB quote online. Our experts are available to help you get exactly what you need and we can make sure you get the right PCB fabrication and PCB assembly solution for your requirements.
| Specifications | Standard Technology | Advanced Technology |
|---|---|---|
| Number of Layers |
1 - 12 |
14 - 40 |
| Quick Turn Times |
up to 24 hours for bare board fabrication or assembly (1-6 layers) |
|
|
Board Material
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Rigid PCB Materials FR4 FR406 370HR VT-47 FR408 Arlon CEM Megtron 6 Astra MT77 Tachyon 100G
Nelco 4000 Taconic TLY Polyimide
MCPCB, Aluminum Core & Copper Core Materials Aluminum Core Copper Core Ventec VT-4A1/VT-4A2 Aismalibar Fastherm Aismalibar Flextherm
Flex PCB Materials Kapton
Shin-Etsu - Epoxy
Rogers - Epoxy
Dupont FR - FR Acrylic
Dupont LF - LF Acrylic Adhesiveless Base Materials |
Aluminum Core Ventec VT-4A1/VT-4A2 Aismalibar Fastherm Aismalibar Flextherm Copper Core Nelco 4000
Rogers 3000 Taconic TLY Polyimide |
| Minimum Board Thickness |
2 layer - 0.010" 4 layer - 0.020" 6 layer - 0.020" 8 layer - 0.062" 10 layer - 0.062" 12 layer - 0.062" |
2 layer - 0.005" 4 layer - 0.010" 6 layer - 0.031" 8 layer - 0.040" |
| Maximum Board Thickness |
2 layer - 0.125" 3-12 layer - 0.200" |
0.250" - 0.500" |
| Maximum Board Size |
16" x 22" 12" x 21"
|
10" x 16" 16" x 22" 12" x 21"
|
| Copper Thickness |
0.5 oz - 3 oz |
4 oz - 10 oz |
| Hole Aspect Ratio |
7 : 1 |
15 : 1 |
| Minimum Hole Size |
0.008" |
0.004" |
| Minimum Trace/Space |
0.006"/0.006" |
0.002"/0.002" |
|
Minimum Drill-to-Copper |
0.010" |
0.005" |
| Minimum Pitch |
1 mm |
0.3 mm |
|
Final Finish
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HASL (Solder) Lead Free Solder Copper Gold Gold Fingers White Tin ENEPIG ENIG |
HASL Gold (ENIG/Hard/Soft) Selective Gold Immersion Silver OSP White Tin ENEPIG |
| Solder Mask |
LPI: Green Black Red Blue Yellow White Clear |
LPI: Green Black Red Blue Yellow White Clear Mix-and-match Wet Mask Dry Film |
| Coverlay |
FR Coverlay LF Coverlay Shin-Etsu Flexible Soldermask |
|
| Silk Screen |
White Black Yellow |
White Black Yellow Green Red Blue |
| PCB Fabrication |
Scoring Route & Retain |
Jump Scoring Route & Retain Milling |
| Additional Features |
Plated Slots Non-plated Slots Controlled Dielectric Covered Vias Counter Sinks Counter Bores Dual Access Flex Suspended Leads |
Plated Edges Plated Milling Plated Counter Bores & Counter Sinks Edge Castellation Controlled Impedance Silver Filled Vias Non-Conductive Filled Vias
|
| Quality Standards |
IPC 6012 Class 2 Electrical Testing 100% Netlist Testing TDR Testing |
Milspec 31032 Milspec 55110 Milspec 50884 IPC 6012 Class 3 100% Netlist Testing TDR Testing |
| Special Technology |
|
Blind & Buried Vias Laser Drilled Vias Mechanically Drilled Micro Vias |
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