Burn-in is a process done to components prior to regular use in which the components are stressed to detect failure and ensure component reliability.
The PCB burn-in process is usually done at 125ºC, with electrical excitation applied to the samples. The process is facilitated by using burn-in boards where the samples are loaded. These boards are then inserted into the burn-in oven which supplies the necessary voltages to the samples while maintaining the oven temperature at 125ºC. The electrical bias applied may either be static or dynamic.
San Francisco Circuits is able to offer the most reliable Printed Circuits Boards because we have formed relationships with trusted PCB Manufacturers in the US and abroad. You won’t have limitations on order quantity or lead time with San Francisco Circuits on a PCB fabrication order.
You can contact us by giving us a call at 800.SFC.5143 or get a PCB quote online for your PCB fabrication needs.
| Specifications | Standard Technology | Advanced Technology |
|---|---|---|
|
Number of Layers |
1 - 18 |
20 - 30 |
|
Board Material |
370HR BT Polymide Nelco 4000-13 |
370HR
BT Nelco 4000-13 |
|
Board Thickness |
0.062'' - 0.125'' |
0.125'' - 0250'' |
|
Board Size |
Smaller then 12''x24'' 12'' x 24'' 19'' x 23'' |
23" x 27" |
|
Hole Aspect Ratio |
12 : 1 |
15 : 1 |
|
Minimum |
0.006'' |
0.005'' |
|
Controlled Impedance |
+/- 10% |
+/- 5% |
|
Minimum Trace/Space |
0.004" |
0.003" |
|
Minimum SMD Pitch |
0.006"/0.006" |
0.003"/0.003" |
|
Final Finish |
ENIG HASL Hard Gold Tin-Nickel |
Hard-Gold ENIG Tin-Nickel
|
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