Lead Free PCB Laminates Lead Free Surface Finishes Lead Free Guarantee Place a Lead Free PCB Order
San Francisco Circuits has been providing our customers with prototype lead free PCBs and lead free production-quantity circuit boards (both RoHS compliant PCBs & WEEE compliant PCBs). We have a large network of manufacturers capable of very fine, high-level technologies with the necessary certifications required, whether it's military PCB certifications or lead free RoHS directives.
In compliance with RoHS directives, our boards do not contain:
We provide PCBs with various lead-free PCB surface finishes:
All of our lead-free PCBs are built from UL approved laminates which withstand the high temperature and long duration assembly cycle (in excess of 260 degrees C). These laminates are suitable for lead free assembly processes that require the laminate base material to withstand temperatures in excess of 260 degrees C or 500 degrees F for extended periods of time. High temperature laminates ensure the higher temperature cycling requirements for some PCB assembly applications.
To learn more about the specific lead free regulation directives, please visit the official source pages below:
Here are the laminates available from our PCB manufacturer network for our lead free PCB assembly process and your lead-free PCB order:
These are the lead-free surface finishes available.
For more detailed information, please visit our in-depth PCB surface finishes page.
Contact our experts at 1.800.SFC.5143 or get a quote online.
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Gold Finish |
May be Electrolytic Electroless, or Immersion |
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- ENIG |
2-5 micro inches. Purpose: To prevent oxidation, extend shelf life, provide a wire bonding surface (when aluminum wire is used), and used to provide an electrically conductive surface on PCBs. Used for solderability when the flatness of the pad is critical. ENIG has shelf life longer then 12 months. |
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- Hard Gold |
Purpose: Used for Gold Fingers (minimum 30 micro inches), soldering (maximum 17 micro inches), to prevent oxidation and extend shelf life. |
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- Soft Gold |
Purpose: Used for wire bonding (Ultrasonic minimum 2 micro inches/Thermasonic minimum 30 micro inches) and to prevent oxidation and extend shelf life. |
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Immersion Silver |
Use for solderability purposes (2-10 micro inches). Used for solderability when the flatness of the pad is critical. |
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Lead Free Solder |
Use for solderability purposes (2-5 micro inches). Used for solderability when the flatness of the pad is not critical. |
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OSP |
Used for solderability when the flatness of the pad is critical. |
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White Tin (Immersion Tin) |
Used for solderability when the flatness of the pad is critical. |
In compliance with RoHS & WEEE directives:
